大功率LED器件热阻的热敏感性研究  

Research in the Heat Sensitivity of Thermal Resistance of High Power LED Devices

作　　者：杨卫桥 张建华[2,3] 殷录桥[2,3] 

机构地区：[1]上海半导体照明工程技术研究中心,上海201203 [2]上海大学新型显示技术及应用集成教育部重点实验室,上海200072 [3]上海大学机械工程与自动化学院,上海200072

出　　处：《激光与光电子学进展》2015年第1期198-202,共5页Laser & Optoelectronics Progress

基　　金：国家973计划(2011CB013103);上海大学科技创新基金;上海市教委高校青年教师培养计划

摘　　要：随着发光二极管(LED)功率的提高,散热的挑战性也越来越高,而热量的集聚会引起LED结温的上升。过高的结温不但会影响LED的光功率和光通量等性能参数,还会使器件寿命急剧衰减。因此掌握LED器件的温升规律成为提高器件可靠性的关键。实验中选取了不同封装结构的LED器件,对不同驱动电流、不同基板温度和不同封装材料的LED器件分别进行了热阻、光功率等性能测试。实验发现,随着电流的增加或者基板温度的升高,LED器件的热阻呈现先下降后上升的趋势,不同封装基板的器件变化幅度有所不同;升高基板温度时,铝基板封装的LED器件由于结温高光功率衰减快热阻呈现下降趋势。结果表明互连材料层、基板的导热能力是影响LED器件热阻差异的关键。As the electric power of high-power light emitting diode （HP-LED） increasing, the challenge of heat dissipation is also becoming higher and higher. The heat which can＇t be dissipated from chip effectively will raise the junction temperature of the LED devices. High junction temperature will not only affect the optical power, flux and other performance of LED devices, but also decay the lifetime of device rapidly. Therefore, knowing the temperature rising rules of HP-LED devices well becomes the key to improve the reliability of devices. The effects of different drive current, different substrate temperatures and different packaging materials on thermal resistance of LED devices are studied. The results show with the increase of current or with the substrate temperature increases, the thermal resistance of LED devices trend to decline and then rise. The changes of thermal resistance of LED devices packaged by aluminum substrates and ceramic substrates are different. When the substrate temperature increases, the thermal resistance of LED devices interconnected by the A1 substrate keeps declining because of the higher pn-junction temperature of the LED device. The tested results of the thermal resistance of LED devices interconnected by different materials show that the thermal resistance are obviously effected by the interconnect layer and the substrate.

关 键 词：光学器件 大功率发光二极管 热阻 光功率 互连材料 

分 类 号：TN364.2[电子电信—物理电子学]