光学元件磨削加工亚表面损伤检测研究  

Research on Detection of Subsurface Damage on Grinding Optical Elements

作　　者：胡陈林[1] 毕果[1] 叶卉[1] 李洪友[2] 

机构地区：[1]厦门大学机电工程系,厦门361005 [2]华侨大学机电及自动化学院,厦门361021

出　　处：《人工晶体学报》2014年第11期2929-2934,共6页Journal of Synthetic Crystals

基　　金：国家自然科学基金(51275433);福建省自然科学基金(2012J05098)

摘　　要：基于氢氟酸刻蚀对光学元件亚表面裂纹影响的刻蚀模型,将化学刻蚀、逐层抛光技术和激光共聚焦扫描技术相结合,提出了一种磨削加工光学元件亚表面损伤的检测方法。实验证实该方法得到的亚表面损伤深度与公认的亚表面损伤预测模型的预测结果吻合性较好,是一种可靠的亚表面深度检测方法。Based on the etching model which hydrofluoric acid etching has an impact on the subsurface cracks of the optical elements, combined chemical etching, step-by-step polishing techniques and confocal laser scanner,a method of detecting sub-surface damage of the optical element was proposed.Research shows that this detection method is intuitive and effective,and the depth of subsurface damage match with the grinding results predicted by the model.

关 键 词：磨削 亚表面损伤 蚀刻 抛光 检测 

分 类 号：TH162.1[机械工程—机械制造及自动化]