伪半固态挤压成形制备高体积分数SiCp/Al复合材料的性能  

Properties of high-volume fraction SiCp/Al composites prepared by pseudo semi-solid extrusive formation

作　　者：阎峰云[1,2] 黄会强[1] 陈体军[1,2] 刘洪军[1] 

机构地区：[1]兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,甘肃兰州730050 [2]兰州理工大学有色金属合金及加工教育部重点实验室,甘肃兰州730050

出　　处：《兰州理工大学学报》2014年第6期5-8,共4页Journal of Lanzhou University of Technology

基　　金：国家自然科学基金(51061010)

摘　　要：采用伪半固态挤压工艺制备SiC体积分数为40%、50%、65%的SiCp/Al复合材料,并对其微观组织和性能进行研究.结果表明:制备的高体积分数SiCp/Al复合材料中SiC颗粒分布均匀,铝合金填充在SiC缝隙中,形成致密组织.Mg和SiO2均能改善SiC颗粒与Al的界面润湿性,增加界面结合强度.所制得的φ(SiC)=65%的复合材料密度为3.11g/cm3,表面硬度为HB 108.5,抗折强度302.1 MPa,热膨胀率低于5.6×10-6/K,热导率为74 W/(m·K);SiC与Al基体界面的破坏以脱粘机制为主.The SiCp/AI composites with SiC volume fraction of 40%, 50% and 65% were prepared by means of pseudo semi-solid extrusion technology and their microstructure and properties were studied. The result showed that the silicon carbide particles distributed evenly in the prepared SiCp/A1 composites with high volume fraction and the aluminum alloy filled in the cracks between the SiC particles, forming a compact tissue. Mg and SiO2 both could improve interface wettability between SiC particles and A1. They also could increase the interface bonding strength of SiC particles and A1. The density of prepared compos- ite with silicon carbide volume fraction of 65 % was 3. 11 g/cm3, surface hardness was HB 108. 5, flexural strength was 302. 1 MPa, thermal expansion rate was less than 5.6 ×10-6/K, and thermal conductivity is 74 W）/（m. K）. The destruction of interface between the SiC and A1 matrix was manifested as of debonding mechanism.

关 键 词：铝基复合材料 挤压工艺 微观组织 力学性能 热物理性能 

分 类 号：TB331[一般工业技术—材料科学与工程]