合金元素对铝基钎料组织和性能的影响  

Effect of Alloy Elements on the Microstructure and Properties of Al-base Solder

作　　者：王艳[1] 徐强[1] 卢红[1] 冉杨[1] 王君君[1] 

机构地区：[1]西华大学材料科学与工程学院,四川成都610039

出　　处：《西华大学学报（自然科学版）》2015年第1期17-21,共5页Journal of Xihua University:Natural Science Edition

基　　金：四川省教育厅重点项目(13ZA0030);西华大学重点科研基金项目(Z1220114)

摘　　要：采用正交试验法设计低熔点Al-Si-Cu-Mg系钎料成分,通过金相、硬度、铺展及差热等方法,分析钎料的显微组织及性能。结果表明:钎料的组织主要由基体相α-Al、粒状相Mg2Si、骨骼状相Al2Cu(θ相),以及θ相和Mg2Si的复杂共晶组成;合金元素对显微硬度及熔化特性的影响由主到次的顺序为Cu、Si、Mg;受金属间化合物Al2Cu和Mg2Si以及初晶Si析出的影响,当Cu、Si含量达到一定值(10%Cu、7.5%Si)后,钎料铺展面积变化不大,试验配方中Al-7.5Si-20Cu-0.4Mg熔点529℃时,铺展面积大,综合性能良好。Alloy composition of low melting-point Al-Si-Cu-Mg solder is designed with orthogonal experiment, the microstruc-ture and properties of the solder are analyzed by means of metallographic examination, hardness measurement, spreadability and differ-ential thermal test method. The results show that the microstructure of solder brazing is mainly composed of matrix phase α -Al, granular phase Mg2 Si, skeletal shape phase Al2 Cu （θ phase） , and the θ phase and Mg2 Si complex eutectic. Effects of alloying ele-ments on microhardness and melting characteristic from primary to secondary are： Cu, Si, Mg. Affected by intermetallic compound Al2 Cu and Mg2 Si as well as the precipitation of primary crystal Si, the spreading areas of solder change little after the contents of Cu, Si reach a certain value （10%Cu, 7. 5%Si）. And as for the Al-7. 5Si-20Cu-0. 4Mg at melting-point 529℃ ,the spreading area get larger and the combination properties is good in experimental formula.

关 键 词：铝基钎料 显微组织 铺展性能 低熔点 显微硬度 

分 类 号：TG454[金属学及工艺—焊接]