电子束固化技术在真空镀铝纸上的应用  

Application of electron beam curing technology in aluminum plating paper

作　　者：余振华[1] 郑迪生 曾晓鹰[1] 詹建波[1] 李赓[1] 刘玉贞 刘庆广 杨建青 

机构地区：[1]红云红河烟草(集团)有限责任公司,云南昆明650202 [2]博源科技材料(烟台)有限公司,山东烟台264670

出　　处：《热固性树脂》2014年第3期48-52,共5页Thermosetting Resin

摘　　要：介绍了电子束(EB)固化及真空镀铝纸生产技术,综述了EB固化在真空镀铝纸生产中的应用进展及特点,并展望了其在真空镀铝纸行业的应用前景。The electron beam（ EB） curing and vacuum aluminum plating paper production technology were introduced. The application progress of EB curing in vacuum aluminum plating paper production and characteristics were reviewed and the prospects of its application in vacuum aluminum plating paper industry was presented.

关 键 词：电子束固化 直接真空镀铝纸 转移真空镀铝纸 

分 类 号：TS758[轻工技术与工程—制浆造纸工程]