DCPD酚型环氧/DCPD苯酚树脂的固化及应用研究  

Study on the curing and application of DCPD phenol type epoxy / DCPD phenol resin

作　　者：方克洪[1] 李辉[1] 

机构地区：[1]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523808

出　　处：《热固性树脂》2014年第4期38-42,共5页Thermosetting Resin

摘　　要：通过DSC分析研究了不同软化点的双环戊二烯(DCPD)酚型环氧与DCPD苯酚树脂在溴化阻燃树脂体系中的固化反应特性并测试了其FR-4覆铜板的性能。结果表明:体系固化反应温度范围较大,DCPD酚型环氧软化点为50,80、90℃时,树脂体系反应活化能分别为98.3,82.3与74.2 kJ/mol。其制成板材的Tg在150℃以上,介电性能良好。随着DCPD酚型环氧树脂软化点的提高,板材玻璃化温度明显提高,高温高压下其吸水率降低,而热分解温度、粘接性及介电性能无明显变化。The curing reaction characteristics of the dicyclopentadiene（ DCPD） phenol epoxy with different softening points and DCPD phenol resin in the brominated flame retardance system were investigated by DSC analysis and their properties of FR- 4 copper clad laminate were tested. The results showed that the curing reaction temperature range of system was large. The resin system activation energies were 98. 3,82. 3 and 74. 2 kJ /mol,respectively when the DCPD phenol type epoxy softening points were 50 ℃,80 ℃,and 90 ℃,The Tgof the laminate made of the resin was above 150 ℃ and had good dielectric properties. With the increasing of DCPD phenol type epoxy resin softening point,Tgof the laminate was significantly increased. The water absorption was decreased under high temperature and pressure and the thermal decomposition temperature,adhesion and dielectric properties had no significant changes.

关 键 词：双环戊二烯苯酚型环氧 固化特性 覆铜板 玻璃化温度 吸水率 介电性能 剥离强度 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]