厚PTFE陶瓷基板钻孔参数的优化探讨  

Discussion on optimization drilling parameters of thick PTFE ceramic substrate

作　　者：张霞 陈晓宇 

机构地区：[1]深圳市景旺电子股份有限公司,广东深圳518102

出　　处：《印制电路信息》2014年第11期23-25,共3页Printed Circuit Information

摘　　要：厚PTFE陶瓷基板是陶瓷粉填充的高频材料,其材料内含有大量陶瓷粉,且有聚四氟乙烯(PTFE)树脂,在钻孔参数设置不当时极易产生孔口披峰、崩孔或铜瘤等问题。结合厚PTFE陶瓷基板板材的特性,从钻孔参数上进行优化试验,以解决此类厚PTFE陶瓷材料的钻孔加工过程中出现的披峰、铜瘤问题。Thick PTFE ceramic substrates is ceramic-filled microwave material, having a lot of ceramic power and PTFE resin. The burrs, block hole or copper tumor are extremely easy to appear if drilling parameters are set incorrectly. In this paper, we will optimize the drilling parameter to solve burrs, block hole and copper tumor as these problems is extremely easy to appear for this type of material. It can provide a reference for industry peer processing thick PTFE ceramic-filled material.

关 键 词：聚四氟乙烯 陶瓷 厚 钻孔参数 优化 

分 类 号：TN41[电子电信—微电子学与固体电子学]