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机构地区:[1]深圳市金洲精工科技股份有限公司,广东深圳518116
出 处:《印制电路信息》2014年第11期32-35,共4页Printed Circuit Information
摘 要:通过物理气相沉积方法,在PCB微钻上沉积硬质HAC涂层,采用扫描电子显微镜、纳米压痕/划痕仪、摩擦磨损试验机等仪器对涂层的硬度、结合强度等力学性能进行了研究,并进行了硬质HAC涂层微钻与未涂层微钻对比加工测试。实验结果表明,硬质HAC涂层的硬度高,与硬质合金基材结合良好,涂层的摩擦系数低;硬质HAC涂层钻头加工典型无卤素板材时,使用寿命是未涂层钻头的2.8倍。Hard HAC coating is deposited on cemented carbide micro-drills for printed circuit boards by physical vapor deposition, and Scanning Electron Microscope and Nano indenter and Nano scratch tester and tribometer are employed to characterize the mechanical properties such as hardness and coating-substrate adhesion of hard HAC coating, and a comparative drilling test between HAC coated drills and uncoated drills has been done. It is indicated that the hardness and elastic modulus of HAC coating are separately,and the adhesion with substrate and meanwhile the coefficient of friction of HAC coating is very good,. It is also found that the service life of HAC coated drills was 2.8 times than that of uncoated ones when drilling typical halogen free printed circuit boards in this paper.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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