微带板高钎透率大面积钎焊技术研究  

Large Area Soldering Technology Research of Substrate with High Soldering Rate

作　　者：皋利利 包晓云 王丽虹 唐怀明 

机构地区：[1]上海航天第802研究所,上海200090 [2]中国人民解放军空军驻上海地区军事代表室,上海200090

出　　处：《电子工艺技术》2015年第1期15-17,41,共4页Electronics Process Technology

基　　金：中国航天科技集团共性工艺基金项目

摘　　要：研究了不同焊接工艺方法、焊膏量以及焊接材料(Sn37Pb、Sn3.5Ag)对微带板与垫板之间大面积钎焊质量的影响。X光检测结果表明,采用优化后的焊接工艺方法及焊膏量,微带板与垫板之间大面积钎焊钎透率可达95%以上;焊点微观组织分析结果表明,Sn3.5Ag焊点内部存在较大尺寸的脆性金属间化合物相,对焊点的力学性能有不利影响,建议使用Sn37Pb焊料进行微带板的焊接。Effects of soldering process, solder paste volume and solder material （Sn37Pb and Sn3.5Ag） on the quality of large area soldering about substrate and baseplate were studied. The X-Ray results show that the soldering coverage of substrate and baseplate is over 95% with optimized soldering process and solder paste volume. The microstructure analysis results show that brittle intermetallic compounds were observed in Sn3.SAg solder joints which will deteriorate the mechanical property of the solder joint. Sn37Pb alloy is recommended for soldering of the substrate and baseplate.

关 键 词：大面积钎焊 高钎透率 焊接工艺方法 焊点微观组织 

分 类 号：TG605[金属学及工艺—金属切削加工及机床]