电镀Cu-Mo-Ni合金的可行性分析  

Feasibility Analysis of Preparation of Cu-Mo-Ni Alloy by Electroplating

作　　者：李远会[1,2] 万明攀[2] 黄碧芳[2] 张晓燕[2] 郭忠诚[1] 

机构地区：[1]昆明理工大学冶金与能源工程学院,云南昆明650039 [2]贵州大学材料与冶金学院,贵州贵阳550003

出　　处：《电镀与环保》2015年第1期16-18,共3页Electroplating & Pollution Control

基　　金：国家自然科学基金(No.50964008);贵州省科学技术基金黔科合J字[2012]2114号

摘　　要：利用常温下的Cu-H2O、Mo-H2O和Ni-H2O的E-pH图,分析电镀Cu-Mo-Ni合金材料的可行性。结果表明:在一定条件下,Cu、Ni可以在热力学稳定区域发生共沉积。Mo在含MoO2-4或Cu2+、MoO2-4水溶液中不能析出。但在Ni 2+诱导下,Mo能以Ni-Mo合金形式析出。因此,电镀法制备Cu-Mo-Ni合金是可能的。The feasibility of electroplating Cu-Mo-Ni alloy based on E-pH diagrams of Cu-H2O,Mo-H2O and Ni-H2O obtained at normal temperature was analyzed.Results showed that codeposition of Cu and Ni can be realized in thermodynamical stable region under certain conditions.In addition,Mo element can＇t precipitate from the aqueous solution containing MoO42-or Cu2＋,MoO42-,while it can precipitate in the form of Ni-Mo alloy with the help of Ni2＋.Therefore,electroplating was a feasible method to prepare Cu-Mo-Ni alloy.

关 键 词：电镀 Cu-Mo-Ni合金 E-pH图 可行性 

分 类 号：TQ153[化学工程—电化学工业]