基带厚度对无磁性Cu-45Ni合金基带立方织构形成的影响  

Effect of Substrate Tape Thickness on Cube Texture Formation of Non-magnetic Cu-45Ni Alloy

作　　者：田辉[1] 索红莉[1] 梁雅儒[1] 马麟[1] 孟易辰[1] 李孟晓[1] 王金华[1] 

机构地区：[1]北京工业大学,北京100124

出　　处：《稀有金属材料与工程》2015年第1期85-90,共6页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51171002);北京市自然科学基金(2132011);北京市自然科学基金重点项目B类(KZ201310005003);高等学校博士学科点专项科研基金(20121103110012);北京市属高等学校创新团队建设与教师职业发展计划(IDHT20130510)

摘　　要：对总形变量相同,厚度分别为80和40μm的Cu-45Ni(at%,下同)合金基带进行再结晶热处理后,采用X射线四环衍射,分析其冷轧织构及再结晶织构;采用电子背散射衍射技术(EBSD),通过对比分析两者高温热处理后立方织构、小角度晶界及孪晶界含量等的变化,研究基带厚度对无磁性Cu-45Ni合金基带立方织构形成的影响。结果表明:对于总形变量均为99%的2种基带,冷轧后均形成"Copper"型轧制织构,且轧制织构对不同厚度的Cu-45Ni合金基带再结晶立方织构的形成影响较小。厚度为40μm的超薄带在高温热处理后更容易形成较强的立方织构,同时小角度晶界的含量也较高,这主要是由于发生部分再结晶时,厚度小的超薄基带中2个立方晶粒相遇并迅速长大,形成强立方织构的几率要大于普通厚度的基带。The cold rolling texture and recrystallization texture of the 99 % reduced Cu-45 Ni alloy substrates with thickness of 80 and 40 μm were investigated by XRD. The recrystallization evolution of those two Cu-45 Ni alloy substrates were also investigated by electron backscattered diffraction（EBSD）. The cube texture formation of Cu-45 Ni alloy substrates with different thicknesses were demonstrated from the fraction of cube texture, low angle grain boundaries, and the average grain size. The results show that a ＂Copper＂ type rolling texture is obtained after 99% deformation reduction for both two tapes, and the rolling texture causes little impact on the cube texture formation. The substrates with 40 μm in thickness have a stronger cube texture and a high fraction of low angle grain boundaries. It is because the probability is higher that two cube grains meet and grow up fast to form a strong cube texture in the substrate with small thickness during partial recrystallization.

关 键 词：Cu-45Ni合金 基带厚度 立方织构 EBSD 

分 类 号：TG146.11[一般工业技术—材料科学与工程]