制备工艺对WCu30合金的显微组织及抗电弧烧蚀性能的影响  

Effect of Preparation Process on Microstructure and Arc-erosion Resistance of WCu30 Alloy

作　　者：王新刚[1] 张怀龙[1] 李文静[1] 刘丽丽[1] 时斌[1] 杨志懋[2] 

机构地区：[1]长安大学,陕西西安710061 [2]西安交通大学,陕西西安710049

出　　处：《稀有金属材料与工程》2015年第1期140-145,共6页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51177006)

摘　　要：采用2种不同的真空熔渗工艺制备出WCu30合金,测定了2种合金的理化性能及力学性能;对2种合金进行了真空电击穿试验,测量其击穿时的截流值和击穿场强;使用SEM分析了2种合金的显微组织及电弧烧蚀后的表面形貌,比较了两者的抗电弧烧蚀能力。结果表明,烧骨架熔渗法制备的WCu30合金显微组织均匀,铜相平均尺寸为10-20μm;混粉熔渗法制备的WCu30合金中的铜相大小不一致,存在长条状铜相聚集体,其最大尺寸可达80-100μm。烧骨架法制备的WCu30合金的硬度、抗弯强度、抗电弧烧蚀能力高于混粉法制备的合金,其电弧侵蚀方式以铜相的蒸发气化为主,而混粉法的合金则以铜相的喷溅方式为主。烧骨架法的WCu30合金的平均耐电压强度高于混粉法合金,而平均截流值低于混粉法合金。WCu30 alloys were prepared by two different vacuum sintering and infiltrating processes, and their physical-chemical and mechanical properties were measured. The tests of vacuum arc breakdown for WCu30 alloy were carried out, and the breakdown field strength and chopping current were measured. The microstructures of WCu30 alloys and their surface morphologies after arc-ablating were investigated by SEM, and their ability against arc-erosion was compared. The results show that the microstructure of WCu30 alloy prepared by high-temperature pre-sintered tungsten skeleton is uniform, and the distribution of Cu phase with an average size of 10~20 μm is basically identical. However, the Cu phase size of WCu30 alloy prepared by mixing induction copper powder is uneven, and the maximum Cu phase aggregation with long strip shape reaches 80~100 μm. The hardness, bending strength, ability against arc-erosion and the dielectric breakdown strength for WCu30 alloy prepared by pre-sintered process are higher than that of WCu30 alloy prepared by mixing process, and its chopping current is lower than that of WCu30 alloy prepared by mixing process. The arc-erosion mechanisms for two WCu30 alloys are different.

关 键 词：WCu合金 耐电压强度 截流值 电弧烧蚀 

分 类 号：TG146.411[一般工业技术—材料科学与工程]