SiC陶瓷真空钎焊接头显微组织和性能  被引量:2

Microstructure and Mechanical Property of Vacuum Brazed SiC Ceramic Joint

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作  者:冯广杰[1] 李卓然[1] 朱洪羽 徐慨[1] 

机构地区:[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001

出  处:《材料工程》2015年第1期1-5,共5页Journal of Materials Engineering

基  金:国家自然科学基金资助项目(51075101)

摘  要:在高真空条件下采用Ti-35Zr-35Ni-15Cu(质量分数/%)钎料对SiC陶瓷进行了钎焊连接,研究了接头界面组织的形成过程以及工艺参数对接头性能的影响。结果表明:钎料与SiC陶瓷发生了复杂的界面反应,生成了多种界面产物。当钎焊温度为960℃,保温时间为10min时,SiC陶瓷侧形成了连续的TiC和Ti5Si3+Zr2Si层,同时Ti5Si3+Zr2Si向钎缝中心生长呈长条状。SiC陶瓷到接头钎缝中心的显微组织依次为:SiC/TiC/Ti5Si3+Zr2Si/Zr(s,s)/Ti(s,s)+Ti2(Cu,Ni)/(Ti,Zr)(Ni,Cu)。钎焊温度为960℃,保温时间为30min时,长条状的Ti5Si3+Zr2Si贯穿了整个接头。钎焊接头强度随着钎焊温度的升高和钎焊时间的延长都呈现先增大后减小的趋势。当钎焊温度为960℃,保温时间为10min时,接头的剪切强度最高,达到了110MPa。SiC ceramic was brazed in vacuum with Ti-35Zr-35Ni-15Cu (mass fraction/%) filler metal. The formation of interfacial structure and effects of technological parameters on joint shear strength were studied. The results show that a series of interface products form owing to the complex interface reactions between the SiC ceramic and filler metal. When the brazing temperature is 960℃ for 10min, TiC and Ti5 Si3 +Zr2Si layers form on the SiC ceramic side. Ti5Si3 +Zr2Si grows towards to the middle of the joint and shows a long strip shape. Microstructure from SiC ceramic to the middle of the joint can be indicated as SiC/TiC/Ti5Si3 +Zr2Si /Zr(s,s)/Ti(s,s)+Ti2 (Cu,Ni)/(Ti,Zr)(Ni,Cu). When the brazing temperature is 960℃ for 30min, long strip shape Ti5Si3+Zr2Si runs through the entire joint. Shear strength of the brazed joint firstly increases then decreases with the rising of the brazing temperature and holding time. The maximum shear strength of the joint with 110MPa is obtained at brazing temperature 960℃ for 10min.

关 键 词:SIC陶瓷 真空钎焊 显微组织 剪切强度 

分 类 号:TG454[金属学及工艺—焊接]

 

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