等静压成型对干湿法结合工艺制备多层片式电感(MLCI)的影响  

Influence of isostatic pressing on manufacturing multilayer chip inductors(MLCI) by dry-wet methods

作　　者：李海鑫[1] 贾利军[1] 李元勋[1,2] 王旭[2] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054 [2]东莞-电子科技大学电子信息工程研究院,广东东莞523808

出　　处：《磁性材料及器件》2015年第1期40-42,80,共4页Journal of Magnetic Materials and Devices

基　　金：广东省引进创新科研团队计划资助项目(201001D0104713329)

摘　　要：用干湿法结合工艺和等静压成型制备多层片式电感（MLCI）。等静压成型较传统的热压成型相比,可以明显提高器件的致密度以及密度均匀性,然而等静压成型压力对于产品的影响却是复杂的。压力过小,产品易出现分层开裂,压力过大则会造成切割线错位以及内电极短路等影响。分析了待切割巴块切割线错位度与等静压压力之间的关系并提出了改进方法。另外,实验也发现了内电极短路率与等静压压力之间的关系,通过实验验证,给出了制造MLCI合理的成型压力范围为4-8MPa。Multilayer chip inductor（MLCI） is prepared by dry-wet methods combining isostatic pressing. Compared with traditional hot pressing molding, isostatic pressing molding can obviously improve the density of products and density uniformity. However, the influence of isostatic pressing pressure on the product is complicated, The product is easy to appear cracking if the pressure is too small. Oppositely, excessive pressure can cause cutting line dislocation and inner electrode short circuit. This paper analyzed the relationship between pressure and the level of cutting line dislocation, and put forward some methods for improvement. What＇s more, the experiments also find the relationship between isostatic pressing pressure and inner electrode shortcut rate. Finally the proper range of molding pressure from 4MPa to 8MPa which can be used for manufacturing MLCI is proposed after verification.

关 键 词：多层片式电感 等静压成型 干湿法结合工艺 切割线错位度 内电极短路率 

分 类 号：TM552[电气工程—电器]