热驱动形状记忆聚合物三维力学本构模型  

3Dconstitutive model of temperature-induced shape memory polymers

作　　者：章巧芳[1] 林文武[1] 张钦[1] 刘云峰[1] 张鹏园 

机构地区：[1]浙江工业大学特种装备制造与先进加工技术教育部重点实验室,浙江杭州310014

出　　处：《浙江工业大学学报》2015年第1期43-46,共4页Journal of Zhejiang University of Technology

基　　金：国家自然科学基金资助项目(51375453)

摘　　要：假设形状记忆聚合物(SMP)为各向同性材料,其体积变形是弹性的,形状变化的流变规律满足Tobushi建立的一维本构模型的基础上,应用固体力学和热粘弹性理论建立了SMP三维本构模型,使其不仅能描述简单应力状态下的热力学行为,也能描述复杂应力状态下的热力学行为.然后基于ABAQUS的二次开发平台编写了可供ABAQUS调用的UMAT子程序,对SMP试样实现形状记忆效应的热力学过程数值模拟,数值模拟结果与Tobushi等的实验结果吻合良好,表明建立的SMP三维本构模型能够有效的描述SMP的热力学行为,可为SMP的工程应用提供理论参考.Assuming the shape memory polymers is an isotropic material,by the application of solid mechanics and thermal viscoelasticity theory,a 3Dconstitutive equation of SMP is developed based on tobushi＇ s 1Dconstitutive equation,so it can not only describe the thermo-mechanical behavior under simple stress state,but also describe the thermo-mechanical behavior under complex stress state.A UMAT subroutine is programmed with fortran based on ABAQUS secondary development platform,then the SMP thermo-mechanical behavior is numerically simulated by ABAQUS.Numerical simulation results coincide with Tobushi＇ s experimental results,which shows the thermo-mechanical behavior of SMP and it＇ s shape memory effect can be described by the three dimensional constitutive model of SMP.

关 键 词：形状记忆聚合物 热驱动 三维本构模型 形状记忆效应 

分 类 号：O343.2[理学—固体力学] O631.21[理学—力学]