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作 者:石璐丹[1] 刘科高[1] 石磊[1] 张敏[1] 杜长全[1]
机构地区:[1]山东建筑大学材料科学与工程学院,山东济南250101
出 处:《电镀与精饰》2015年第2期24-27,共4页Plating & Finishing
基 金:国家自然科学基金(No.51272140)
摘 要:利用电沉积的方法制备氧化亚铜薄膜,研究了络合剂的种类、浓度、后处理工艺及沉积时间对薄膜成相的影响。研究表明,络合剂柠檬酸钠有利于形成氧化亚铜薄膜;随着柠檬酸钠的浓度增加,薄膜中氧化亚铜含量降低,铜单质含量升高;沉积薄膜后,后处理对薄膜成相影响很大,烘干前不清洗薄膜中含有溶液中物质;随着沉积时间变长,薄膜变厚,然后出现掉膜现象。实验结果表明,选用柠檬酸钠为络合剂,柠檬酸钠的浓度为0.015 mol/L,沉积t为30 min,沉积薄膜后用蒸馏水清洗,制备出结晶良好,表面呈均匀纯相的氧化亚铜薄膜。Cuprous oxide thin film was prepared by electro-deposition method. Effects of type and concentration of complexing agent, post-treatment process and deposition time on the film phase formation were studied. Results showed that : with concentration increasing of the complexing agent sodium citrate, cuprous oxide content in the film was decreased while elemental copper content was increased; after dep osition of the film, the post-treatment process had a great impact on the film phase, if the solution contained substances remaining in the film were not well cleaned, with the prolonging of deposition time, film thickness would become thick first and then the film might appear off. Experimental results showed that the cuprous oxide film with good crystallinity, uniform surface and pure phase could be prepared under the condition as following: chosing sodium citrate as complexing agent, sodium citrate concentration 0.015 mol/L, deposition time 30 min and washing the film with distilled water after the film deposition.
分 类 号:TQ153[化学工程—电化学工业]
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