络合剂对化学镀镍-磷合金的影响  

The impact of Complexing Agents on Electroless Ni-P Alloy Plating

作　　者：李雨[1] 杨晨[1] 刘定富[1] 

机构地区：[1]贵州大学,贵州贵阳550025

出　　处：《电镀与精饰》2015年第2期33-36,共4页Plating & Finishing

基　　金：铝合金化学镀镍关键技术开发[合同编号:黔科合GY字(2013)3035]

摘　　要：对确定的化学镀Ni-P合金工艺实验路线,筛选5种不同络合剂的单因素实验获得了厚度大致相同的镀层,并考察各络合剂对Ni-P合金化学镀的影响。结果表明,对沉积速率的影响丁二酸>乳酸>氨基乙酸>柠檬酸>EDTA;对耐蚀性的影响柠檬酸>氨基乙酸>丁二酸>EDTA>乳酸。并通过正交试验得出络合剂的最佳复配组合,10 m L/L乳酸、8 g/L丁二酸和12 g/L柠檬酸,沉积速率为14.5μm/h,耐盐雾达到24.5 h。In order to optimize the technology of electroless Ni-P alloy plating process, the same thickness coatings were obtained by the single factor experiment of selecting five kinds of complexing agents. The impact on the plating rate is： succinic acid 〉 lactic acid 〉 amino acetic acid 〉 citric acid monohydrate 〉 EDTA ;the impact on the corrosion resistance is ： citric acid monohydrate 〉 amino acetic acid 〉 succinic acid 〉 EDTA 〉 lactic acid. The orthogonal experimental results show that the best combination of complexing agents is 10 mL/L lactic acid,8 g/L succinic acid and 12 g/L citric acid monohydrate, and then the plating speed is 14.5 μm/h.

关 键 词：络合剂 化学镀 镍-磷合金 耐蚀性 

分 类 号：TQ153.12[化学工程—电化学工业]