退火温度对铜/铝复合板剥离性能的影响  

Effects of Annealing Temperature on Peeling Properties Development of Cu/Al Bi-metal Plates

作　　者：袁武华[1] 周静 

机构地区：[1]湖南大学材料科学与工程学院,湖南长沙410082

出　　处：《湖南大学学报（自然科学版）》2014年第12期1-5,共5页Journal of Hunan University:Natural Sciences

基　　金：国家自然科学基金资助项目(51274092)

摘　　要：采用异步轧制方法制备铜/铝复合板,用电子万能试样机、扫描电子显微镜(SEM)及能谱仪(EDS)等分析测试手段,研究扩散退火对于铜/铝复合板结合强度、剥离裂纹位置及剥离断口化学成分的影响.研究发现,扩散退火使复合板结合强度降低,扩散层厚度随退火温度的提高而增大.复合板经350℃保温2h后,在铜/铝界面形成厚7.31μm的扩散层,经500℃保温2h后,形成厚15.53μm扩散层.退火态铜/铝复合板剥离裂纹位于靠近扩散层中间的富铝层,剥离断裂处的金属间化合物为CuAl和CuAl2.退火时形成的脆性金属间化合物以及轧制过程中形成的裂纹及未结合区是造成结合强度降低的主要原因.铜/铝轧制复合板宜采用低于350℃温度进行退火.Cu/Al bi-metal plates were produced by asymmetrical cold rolling and subsequent annealing treatments were applied to the as-rolled bi-metal plates.The effects of annealing temperature on the bond strength,locations and compositions of de-bonding failure layer development of the samples were investigated by using Instron tensile testing machine,Scanning Electron Microscopy （SEM） and Energy Dispersive Spectrometer （EDS）.The study revealed that diffusion annealing generally did not improve the bond strength of Cu/Al bi-metal plates.The thickness of diffusion layers reached 7.31 μm when annealed at 350 ℃ for 2 hours and 15.53 μm when annealed at 500 ℃ for 2 hours.Through microstructural inspection,it was found that fractures of the as-peeled materials appeared in the Al-rich layer near the middle of the diffusion layers.Further investigations indicated that the major compositions of fracture layers were CuAl and CuAl2 phases.Brittle intermetallic phases generally determined the bond strength of Cu/Al bi-metal plates.Furthermore,bond strength was also related to the original cracks and no-bonding area formed during cold rolling.When annealing temperature fell below 350℃,Cu/Al bi-metal plates displayed relatively better bonding properties.

关 键 词：Cu/Al复合板 轧制 退火 金属间化合物 界面 

分 类 号：TG339[金属学及工艺—金属压力加工]