AgSnO_2/Cu复合铆钉触点在服役过程中的界面开裂  

Interface Cracks of AgSnO_2/Cu Bimetal Layered Contact Rivet During Service

作　　者：王勇 徐永红[1] 程世芳 章应 田茂江 周晓荣 

机构地区：[1]重庆川仪金属功能材料分公司重庆市电子电器功能材料工程技术研究中心,重庆400702 [2]重庆大学材料科学与工程学院,重庆400045

出　　处：《电工材料》2015年第1期3-7,11,共6页Electrical Engineering Materials

基　　金：重庆市应用开发计划项目(cstc2013yykf B50005);"十二五"国家科技支撑计划项目(2012BAE06B06)

摘　　要：裂纹是影响电触点使用寿命的主要原因之一,本文对AgSnO2/Cu复合铆钉触点的常见裂纹进行了归纳分析。从裂纹产生的部位来看,复合铆钉触点中的裂纹主要有两类,一类产生于AgSnO2触点层,其起源主要是Ag与SnO2颗粒界面;另一类产生于AgSnO2与Cu的界面,其起源一是结合界面本身,二是AgSnO2触点层裂纹扩展至界面而成。两类裂纹均缩短触点使用寿命,但AgSnO2/Cu界面裂纹危害更大。改善Ag与SnO2颗粒的高温润湿性和提高AgSnO2/Cu界面结合强度是改善复合铆钉触点性能的重要途径。Some common causes of cracking, which is one of the primary defects influencing thelife of AgSnO2/Cu bimetal layered rivets, are analyzed in this paper. According to the crackinglocation, two kinds of cracks are found in bimetal rivets. One is formed in the AgSnO2 layer andusually originated from the interface between Ag and SnO2 particles. The other one is formed inthe interface between AgSnO2 and Cu. The second one may be originated in the interface itself,or be the propagation in the interface of the cracks originating from the AgSnO2 layer. Thesecond kind of cracks is more harmful, even though both cracks decrease the life of rivets. Inorder to improve the properties of AgSnO2/Cu bimetal rivets, it is important to increase the wettabilitybetween Ag and SnO2 particle at elevated temperature and the bonding strength between ofAgSnO2/Cu interface.

关 键 词：AGSNO2 复合铆钉 裂纹 界面 

分 类 号：TM501.3[电气工程—电器] TG146.32[一般工业技术—材料科学与工程]