激光诱导击穿光谱法对焊接接头表面渗铜区铜元素的深度分布分析  

Depth distribution analysis of copper in copper infiltration zone of welding joint surface by laser induced breakdown spectrometry

作　　者：李冬玲[1,2] 张勇[1] 鹿锋华[3] 

机构地区：[1]钢铁研究总院,北京100081 [2]金属材料表征北京市重点实验室,北京100081 [3]中国石油天然气管道科学研究院,河北廊坊065001

出　　处：《冶金分析》2015年第1期19-25,共7页Metallurgical Analysis

基　　金：2011年科技部创新方法专项(2011IM010600)

摘　　要：采用激光诱导击穿光谱法(LIBS)对不同工艺下的焊接接头根部中心区域进行了铜的深度分布分析,探讨了不同材料的LIBS激发脉冲数目与其剥蚀深度的相关性,发现在10个脉冲内脉冲数目与剥蚀深度有良好的一次线性关系,同样的脉冲数目激发焊材所得的剥蚀深度要小于铜衬垫,并由此计算了焊接接头根部中心部位渗铜区域的深度。同时,绘制了匹配的中低合金钢的定量分析校准曲线,并对不同渗铜区深度方向的铜含量进行了分布分析,发现不同工艺下的焊接接头的渗铜程度有较大差别:带铜垫脉冲控制工艺焊接的接头在某些区域出现了较为严重的渗铜现象,表面渗铜质量分数超过了0.5%,同时渗铜深度超过了50μm;铜垫短弧控制工艺焊接的SY2样品有少量渗铜,但表面渗铜质量分数均没有超过0.5%,且渗铜深度均不到10μm;而无铜垫脉冲控制工艺焊接样品SY3则表面没有出现渗铜现象。Laser induced breakdown spectrometry （LIBS） was used for the depth distribution analysis of Cu in the central zone of welding joint root from different product technology. The relationship between the number of excitation pulses of LIBS and the ablation depth in different materials was investigated. It was found that there was good linear relationship between excitation pulse and ablation depth within ten pulses and the depth of ablation depth on welding material was smaller than the depth on copper back-up shoes. The depth of copper infiltration zone was calculated. At the same time, the matched quantitative analysis calibration curve was drawn and the content distribution of copper in the depth direction of different copper infiltration zone was obtained. It was found that there was great difference for the degree of copper infiltration from different product technologies. Serious copper infiltration appeared in some zone of the welding joint using the pulse control technology with copper back-up shoes root welding. The mass fraction of copper in the surface was above 0.5 % and the depth of copper infiltration also surpassed 50μm. There was a little copper infiltration for sample SY2 welded by short ace control technology with copper back-up shoes root and the content of copper in the surface didn＇t supass 0.5% with the infiltration depth below 10μm. But the phenomenon of copper infiltration didn＇t appear in the SY3 sample without copper back-up shoes root welding technology.

关 键 词：激光诱导击穿光谱法 铜衬垫 焊接 铜 深度分布 

分 类 号：TG407[金属学及工艺—焊接]