Sn60Pb40焊层在热循环过程中蠕变行为的仿真研究  

Simulation Study on Creep Behavior for Sn60Pb40 Welding Layer during Thermal Recycle

作　　者：杨静[1] 王志海[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子机械工程》2015年第1期42-45,共4页Electro-Mechanical Engineering

摘　　要：文中采用ANAND焊点本构关系模型描述了Sn60Pb40焊层蠕变行为,通过MARC有限元软件模拟了电子封装器件Sn60Pb40焊层在热循环中的蠕变过程,研究了Sn60Pb40焊层的蠕变应变最大值出现的位置,分析了封装结构热失配和焊层厚度对Sn60Pb40焊层蠕变应变的影响。结果表明:焊层边角处最早发生蠕变断裂,降低封装结构热失配程度和优化焊层厚度均可减小Sn60Pb40焊层的蠕变变形。该研究结果不仅为封装结构的热匹配优化设计提供了新的思路,也为预测焊层蠕变断裂位置和优化工艺提供了技术支持。In this paper,the creep behavior for Sn60Pb40 welding layer,which is described using ANAND solder constitutive relation model,is simulated by MARC software during thermal cycle. The location of maximum equivalent creep strain for the welding layer is studied and the influence of electronic package structure thermal mismatch and welding layer thickness on Sn60Pb40 creep behavior is analyzed. The results show that the welding layer creep fracture first appear at the corner,and the Sn60Pb40 welding layer creep strain can be reduced by decreasing the package structure thermal mismatch and optimizing welding layer thickness. The results provide a new thought of package structure thermal match optimization design and technical support for the prediction of the welding layer creep fracture location and the optimization of process.

关 键 词：Sn60Pb40焊层 蠕变应变 热循环 热失配 

分 类 号：TP391.99[自动化与计算机技术—计算机应用技术]