超光滑加工精磨过程中损伤层与余量匹配的研究  

Research on Surface Damage and Process Redundancy Match During Grinding in Super-Smooth Fabrication

作　　者：陈光[1] 熊长新[1] 

机构地区：[1]华中光电技术研究所-武汉光电国家实验室,湖北武汉430223

出　　处：《光学与光电技术》2015年第1期68-73,共6页Optics & Optoelectronic Technology

基　　金：船舶预研基金(62101050503)资助项目

摘　　要：对超光滑加工散粒研磨工序中采用的三级精磨法,进行了实验研究,通过改进差分化学刻蚀实验测出各级损伤层的厚度,利用损伤层厚度对加工余量匹配进行了优化。研究表明损伤层厚度与砂粒的粒径和压载之积成线性关系,与研磨时长无关;实验测得W28、W10、W5号磨料在实验条件下研磨加工产生的损伤层厚度分别为12.4μm、8.2μm、5.8μm;并根据损伤层厚度提出了加工余量的匹配建议方案。损伤层的相关研究为超光滑加工中提高生产效率以及减少麻点产生几率的研究提供了参考。The three stage grinding method in the Super-Smooth fabrication particle grinding process was experimentally re- searched. The thicknesses of each surface damage layer was measured by developing the HF differential etch rate method. On the basis of the measured results, the distribution of process redundancy was optimized. The results of study show that the relationship between damage layer thickness and the product of particle size and load is linear. The surface damage layer thicknesses created by W28/W10/W5 abrasive are 12.4 μm/8.2 μm/5.8 μm. And a project of the matching of process re- dundancy is proposed. The research about surface damage layer could be used to solve the issues such as improving the pro- duction efficiency or decreasing the probability of pitting.

关 键 词：超光滑加工 研磨 损伤层 加工余量 

分 类 号：TQ171.684[化学工程—玻璃工业]