第三代红外焦平面探测器读出电路  

Read Out Integrated Circuit for Third-Generation Infrared Focal Plane Detector

作　　者：白丕绩[1] 姚立斌[1] 

机构地区：[1]昆明物理研究所,云南昆明650223

出　　处：《红外技术》2015年第2期89-96,共8页Infrared Technology

基　　金：国防预研基金

摘　　要：对红外探测器不断增长和提高的需求催生了第三代红外焦平面探测器技术。根据第三代红外探测器的概念,像素达到百万级,热灵敏度NETD达到1 m K量级是第三代制冷型高性能红外焦平面探测器的基本特征。计算结果表明读出电路需要达到1000 Me-以上的电荷处理能力和100 d B左右的动态范围(Dynamic Range)才能满足上述第三代红外焦平面探测器需求。提出在像素内进行数字积分技术,以期突破传统模拟读出电路的电荷存储量和动态范围瓶颈限制,使高空间分辨率、高温度分辨率及高帧频的第三代高性能制冷型红外焦平面探测器得到实现。The ever increasing demand of thermal imaging system calls the third generation infrared focal plane array（IRFPA）. The basic parameters of the third generation high-performance cooled IRFPA is million-pixel array and around 1m K NETD. The third-generation IRFPA requires high performance readout integrated circuit（ROIC）. If the ROIC can＇t handle 1000 Me-charge capacity and about 100 dB dynamic range,it will not meet the demand of the third generation IRFPA. The in-pixel digital integration technology is introduced to break the barriers of the charge storage capacity and dynamic range of traditional analog ROIC. With the digital integration technique, the third-generation cooled IRFPA can be implemented with high spatial resolution, high temperature definition and high frame rate.

关 键 词：第三代红外焦平面探测器 高温度分辨率 高动态范围 数字积分技术 像素级ADC数字读出电路 

分 类 号：TN215[电子电信—物理电子学]