Sb,Bi元素对Sn-22Sb高温钎料合金组织的影响  

Effects of Sb and Bi on the Microstructure of Sn-22Sb Solder Alloy

作　　者：甘树德[1] 甘贵生[1] 王涛[2] 杜长华[1] 李宏博 

机构地区：[1]重庆理工大学材料科学与工程学院,重庆400054 [2]长江师范学院机械与电器工程学院,重庆408100 [3]攀枝花材料工程学院,四川攀枝花617000

出　　处：《精密成形工程》2014年第3期50-53,63,共5页Journal of Netshape Forming Engineering

基　　金：重庆市教委/科技研究一般项目(KJ130813);重庆理工大学科研启动基金(2012ZD12)

摘　　要：目的研究Sb和Bi元素对Sn-22Sb钎料显微组织的影响。方法制备了(Sn-22Sb)-xBi和Sn-xSb钎料合金,并分别采用差热分析和X射线衍射仪,分析了材料的熔化特征和物相。结果结果表明:Sn-22Sb钎料合金主要由灰色的β-Sn和白色块状的Sb2Sn3构成;少量的Bi使得Sn-22Sb钎料合金中Sb2Sn3金属间化合物逐渐细化和均匀化,数量却急剧增加;大量添加Sb后,使得Sn-22Sb钎料合金几乎全部变为粗大的块状β-SnSb组织,钎料合金的开始熔化温度有所提高。结论通过添加其他合金元素,降低Sn-50Sb钎料液相线温度,使其有望应用于二次回流焊。Objective To investigate the effects of Sb and Bi on the microstructure of Sn-22Sb Solder alloy. Methods （Sn-22Sb）-xBi and Sn-xSb solder alloys were prepared. The melting behavior and phase were analyzed by differential scanning calorimetry （DSC） and X-ray diffraction （XRD）, respectively. Results Sn-22Sb solder alloy was mainly composed of gray 13-Sn and white block Sb2Sn3. A small amount of Bi made the microstructure of Sb2Sn3 intermetallic compound in Sn-22Sb solder alloy fine and homogenized. Thick massive β-SnSb could be found in Sn-50Sb solder alloy, and the initial melting temperature of Sn-50Sb solder alloy increased. Conclusion The liquidus temperature of the Sn-50Sb solder was reduced by adding other alloying elements, leading to possible application in secondary reflow soldering.

关 键 词：高温钎料 Sn-22Sb 组织 熔化温度 

分 类 号：TG425.1[金属学及工艺—焊接] TG115.21