有机硅改性环氧树脂包封料的研制  

Study on preparing silicone modified epoxy resin encapsulate material

作　　者：范玲玉[1] 陈立新[1] 高李帅[1] 杨军[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《中国胶粘剂》2014年第7期24-28,共5页China Adhesives

摘　　要：在无溶剂条件下,采用熔融缩聚法制备了一系列DHDPS（二苯基硅二醇）、PTS（聚甲基三乙氧基硅烷）改性EP（环氧树脂）;然后以此为基体树脂,将其与酸酐固化剂、促进剂和颜填料等共混后,制成粉末包封料;最后将该包封料与溶剂混合均匀后,制成包封浆料。研究结果表明：DHDPS、PTS均分别与EP发生了接枝共聚反应;当m（EP）∶m（DHDPS）=100∶30、m（EP）∶m（PTS）=100∶20时,两者失重50%时的热分解温度分别比改性前提高了94.7℃和115.3℃,750℃时的残炭率也分别提高了7.9%、14.2%;两者的理化性能均符合技术指标要求,但后者的冻融稳定性更好,前者的包封浆料的适宜黏度为170~200 mPa·s。A series of DHDPS（diphenylsilanediol）or PTS（polymethyltriethoxysilane）modified EP（epoxy resin）were prepared by melt polycondensation method without solvent. Then,with the modified EP as matrix resin,a powder coating material was prepared by polyblend among matrix resin,anhydride curing agent,accelerant and pigment-filler. Finally,an encapsulate material was prepared by even blend between coating material and solvent.The research results showed that the graft copolymerizations between EP and DHDPS or EP and PTS were respectively occurred. The pyrolysis temperatures at weightlessness 50% of two modified systems were 94.7 ℃ and 115.3 ℃respectively more than those of unmodified system,the carbon yields at 750 ℃ of two modified systems were 7.9% and 14.2% respectively more than those of unmodified system when mass ratios of m（EP）∶m（DHDPS）or m（EP）∶m（PTS）were 100∶30 or 100∶20. The physical and chemical properties of two modified systems could all meet requirements of technical indexes,but the freeze-thaw stability of the latter was better. The suitable viscosity of encapsulate material was 170-200 mPa·s.

关 键 词：二苯基硅二醇 聚甲基三乙氧基硅烷 环氧树脂 包封料 

分 类 号：TQ433.437[化学工程]