N5单晶含取向差TLP接头显微组织与断裂机理  

Microstructure and Fracture Mechanism of N5 Single Crystal TLP Joint With Misorientation

作　　者：柴禄[1] 黄继华[1] 王立[1] 侯金保[2] 郎波[2] 

机构地区：[1]北京科技大学材料科学与工程学院 [2]中航工业北京航空制造工程研究所航空发动机工艺研究室

出　　处：《航空制造技术》2015年第3期64-67,共4页Aeronautical Manufacturing Technology

摘　　要：为研究N5单晶含取向差TLP接头组织和断裂机理,制备了有取向差和无取向差的接头。对接头微观组织进行SEM检测,跨焊缝进行了EBSD检测,并对接头进行了高温持久拉断试验。结果表明,两侧母材存在10。取向差时焊缝中心无法实现单晶化而形成晶界,晶界处元素偏聚导致在降温过程中形成碳化物和硼化物的第2相粒子;断口分析表明B接头以准解理形式断裂,裂纹起源于第2相粒子。Joints with or without misorientation are prepared in order to discuss the microstructure and fracture mechanism of a joint that with a misorientation.Microstructure is SEM tested,orientation data are observed by the method of EBSD and the high temperature creep rupture tests are carried out.Results show that crystal boundary can be found in the center line when there is a 10 degree misorientation between the two parts of base metal.Carbide and boride are formed by the effect of high energy boundary and element segregation.Fracture analysis reveals that cracks generate from the second phase particle and the joint fractures in the form of quasi-cleavage fracture.

关 键 词：单晶高温合金 过渡液相扩散 EBSD组织 断裂 

分 类 号：V261.34[航空宇航科学与技术—航空宇航制造工程]