长期热循环条件下Nb-TiAl合金的显微组织演变  

Microstructure Evolution of Alloy Nb-TiAl During Long-term Thermal Cycling

作　　者：卞琛[1,2] 王新贸 

机构地区：[1]新疆大学信息科学与工程学院,新疆乌鲁木齐830046 [2]乌鲁木齐职业大学信息工程学院,新疆乌鲁木齐830023 [3]新疆八钢金圆钢管有限公司,新疆乌鲁木齐830023

出　　处：《铸造技术》2015年第2期306-308,共3页Foundry Technology

摘　　要：研究了全片层高Nb-TiAI合金在长期热循环条件下的显微组织演变。结果表明,高Nb-TiAI合金的显微组织不稳定性主要表现为界面缺陷及晶界的迁移。其中界面缺陷的迁移是由α2片层的溶解和片层内γ晶粒的析出所致,而晶界迁移则是由片层的不连续粗化和γ晶内α2相的生成所引起的。The microstructure evolution of the entire film storey alloy Nb-TiAI during long-term thermal cycling was investigated. The results show that the microstructure instability of high Nb-TiAI alloy mainly is caused by the migrations of interface defects and grain boundaries. The migration of interface defects is resulted from the dissolution of lamellar α2 and precipitation ofγ grains within the lamellar, while the migration of grain boundary is induced by the discontinuous coarsening of lamellar and the formation of phaseα2 in γ grain.

关 键 词：长期热循环 镍基合金 不连续粗化 

分 类 号：TG146.23[一般工业技术—材料科学与工程]