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作 者:孔祥挺 周旭亮 李士颜 乔丽君 刘洪刚 王圩 潘教青
机构地区:[1]Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083 [2]Microwave Device and IC Department, Institute of Microeleetronics, Chinese Academy of Sciences, Beijing 100029
出 处:《Chinese Physics Letters》2015年第3期121-123,共3页中国物理快报(英文版)
摘 要:We demonstrate high-performance In0.23 Ga0.77 As channel metal-oxide-semiconductor field-effect transistors ( MOS- FETs) with high on-current to off-current (Ion/Ioff) ratio grown on semi-insulating GaAs wafers by metal-organic chemical vapor deposition (MOCVD). The 2μm channel-length devices exhibit a peak extrinsic transeonductance of 150 mS/mm and a drain current up to 500 mA/mm. The maximum effective mobility is 1680 cm2/Vs extracted by the split C-V method. Furthermore, the Ion/Ioff ratio is significantly improved from approximately 4.5 × 10^3 up to approximately 4.32 × 10^4 by controlling the etch thickness of In0.49Ga0.51P, The high drain current and high Ion/Ioff ratio of the In0.23Ga0.77As channel MOSFETs are achieved due to the high effective mobility and the low gate leakage current density.We demonstrate high-performance In0.23 Ga0.77 As channel metal-oxide-semiconductor field-effect transistors ( MOS- FETs) with high on-current to off-current (Ion/Ioff) ratio grown on semi-insulating GaAs wafers by metal-organic chemical vapor deposition (MOCVD). The 2μm channel-length devices exhibit a peak extrinsic transeonductance of 150 mS/mm and a drain current up to 500 mA/mm. The maximum effective mobility is 1680 cm2/Vs extracted by the split C-V method. Furthermore, the Ion/Ioff ratio is significantly improved from approximately 4.5 × 10^3 up to approximately 4.32 × 10^4 by controlling the etch thickness of In0.49Ga0.51P, The high drain current and high Ion/Ioff ratio of the In0.23Ga0.77As channel MOSFETs are achieved due to the high effective mobility and the low gate leakage current density.
关 键 词:As Channel MOSFETs with High Current Ratio I MOSFET Ga Grown on Semi-insulating GaAs Substrates by MOCVD off
分 类 号:TN386[电子电信—物理电子学]
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