中低温固化高性能环氧树脂TGDDM体系性能研究  

Study on Properties of Medium-low Temperature Cured TGDDM Epoxy System with High-performance

作　　者：张书亭[1,2] 王智[1,2] 赵贵哲[1,2] 杜瑞奎[1,2] 张彦飞[1,2] 刘亚青[1,2] 

机构地区：[1]中北大学山西省高分子复合材料工程技术研究中心,太原030051 [2]中北大学材料科学与工程学院,太原030051

出　　处：《工程塑料应用》2015年第3期40-44,共5页Engineering Plastics Application

摘　　要：为解决二氨基二苯甲烷四缩水甘油醚(TGDDM)成型过程中高温固化引起的内应力增加、不易操作和低温固化所带来的低热稳定、低力学强度的问题,采用中温固化剂(JH)和高温固化剂(DDS)同时固化TGDDM,考察了三元复配体系的固化行为、力学性能及热稳定性。结果显示,当共混体系中TGDDM,DDS,JH的组成比例为100∶10∶30(TSJ–3)时,体系初始固化温度下降至50℃左右,且TSJ–3体系表现出最佳的弯曲性能和最好的热稳定性,满足了中低温固化,同时具有出色的热稳定性和较好的力学性能的要求。In order to get the TGDDM which cured at medium-low temperature with high heat resistance and high strength, a method of mixing middle temperature curing agent（JH） and high temperature curing agent（DDS） was studied. The curing behavior, mechanical properties and thermal stability of ternary compotmd system were investigated. The results show that when the mass ratio of TGDDM, DDS, JH is 100 ： 10 ： 30（TSJ-3）, the initial curing temperature of the system decreases to about 50℃ ; The TSJ-3 system can meet the requirement of curing at low temperature, meanwhile possessing excellent thermal stability and good mechanical properties.

关 键 词：TGDDM 热稳定性 复配 中低固化温度 

分 类 号：TQ430.1[化学工程]