检索规则说明:AND代表“并且”;OR代表“或者”;NOT代表“不包含”;(注意必须大写,运算符两边需空一格)
检 索 范 例 :范例一: (K=图书馆学 OR K=情报学) AND A=范并思 范例二:J=计算机应用与软件 AND (U=C++ OR U=Basic) NOT M=Visual
作 者:董凤[1] 陈少平[1] 樊文浩[1] 胡利方[1] 孟庆森[1]
机构地区:[1]太原理工大学,山西太原030024
出 处:《稀有金属材料与工程》2015年第2期349-354,共6页Rare Metal Materials and Engineering
基 金:国家自然科学基金(50975190;51101111);山西省青年科学研究基金(2011021022-3)
摘 要:本试验采用电场激活扩散连接技术(FADB)实现了Ti/Ni的扩散连接。研究了Ti/Ni两种材料发生界面扩散反应时新相的生成规律及其对连接强度的影响。利用扫描电子显微镜及能谱仪观察和分析了扩散层的显微组织、相组成和界面元素分布。采用万能试验机对扩散层的抗剪切性能进行了测试。研究结果表明,在电场作用下,Ti与Ni通过固相扩散形成了良好的冶金结合界面,界面处金属间化合物的生成次序依次为Ni3Ti、Ni Ti2、Ni Ti。当扩散温度≥750℃时,Ti表现出超塑性和良好的扩散性,促使扩散层中的Ni3Ti转变成富钛层,该富钛层的形成有利于接头强度的提高。界面的剪切强度随着电流的增大而增大,当电流为930~1200 A时,界面的剪切强度可达90.54 MPa。The diffusion bonding between Ti/Ni was carried out by Field Activated Diffusion Bonding process(FADB). The formation of new phase during interfacial diffusion reaction between Ti/Ni and its effect on bonding strength were studied. The microstructure, phase component and element distribution across interfaces were observed and determined by SEM and EDS. The shearing properties of bonded interface were evaluated by a universal testing machine. The results indicate that complete metallurgical bonding between Ti/Ni has been reached, which is composed of intermetallics of Ni3 Ti, Ni Ti2 and Ni Ti in order. When the diffusion bonding temperature is as high as 750 oC, Ti shows good performance of superplasticity and high diffusivity, which promotes Ni3 Ti to transform into Ti-rich layer during diffusion bonding. The formation of Ti-rich layer improves the shearing strength of interface. The shearing strength of the Ti/Ni interface increases with increase of current, and when the current is 930~1200 A, it reaches 90.54 MPa.
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在链接到云南高校图书馆文献保障联盟下载...
云南高校图书馆联盟文献共享服务平台 版权所有©
您的IP:216.73.216.52