Zr-8.8Al合金化学镀前浸锌处理工艺研究  

Zn-Dipping Pre-plating Process for Electro-less Plating on Zr-8.8Al Alloy

作　　者：马静[1] 李强[1,2] 李永刚[1] 李扬[1] 

机构地区：[1]河北科技大学,河北石家庄050018 [2]燕山大学亚稳材料科学与制备技术国家重点实验室,河北秦皇岛066004

出　　处：《稀有金属材料与工程》2015年第2期433-437,共5页Rare Metal Materials and Engineering

基　　金：国家"973"计划项目(2010CB731604);河北科技大学杰出青年基金项目

摘　　要：采用浸锌法对Zr-8.8Al合金进行了化学镀前处理,研究了浸锌液配方及工艺对化学镀Ni-P镀层显微结构、显微硬度、抗蚀性的影响规律。结果表明,室温下二次浸锌处理90 s浸锌层均匀致密;浸锌后进行化学镀处理获得的Ni-P镀层为非晶结构,胞状结构,与基体结合良好。与裸材相比,室温下浸锌液为:Zn SO4 280 g/L、Na OH 20 g/L、Na NO42 g/L、KNa C4H4O6 20 g/L,一次浸锌处理60 s,二次浸锌30 s获得的Ni-P镀层显微硬度提高了80%,在3.5%Na Cl(质量分数)溶液中自腐蚀电位发生正移,极化腐蚀后镀层较完整,保护性较优。Zn-dipping pretreatment was preformed for electro-less Ni-P plating on Zr-8.8Al alloy. The effect of prescription of Zn-dipping solution and Zn-dipping process on the microstructure, microhardness and corrosion resistance of electro-less Ni-P plating in 3.5 wt%Na Cl solution was investigated. The results show that the Zn-dipping film by a double Zn-dipping method at room temperature is uniform and compact. The electro-less Ni-P plating has amorphous cellular structure and is tightly bonded to the substrate. Compared with that of nonplated alloy, the microhardness of electroless Ni-P plating after Zn-dipping pretreatment is improved by 80%. The corrosion potential of electro-less Ni-P plating after Zn-dipping pretreatment in 3.5 wt% Na Cl solution shift positively. The plating after corrosion is still complete. The optimum Zn-dipping prescription is Zn SO4 280 g/L, Na OH 20 g/L, Na NO3 2 g/L and KNa C4H4O6 20 g/L. The optimum Zn-dipping process is Zn-dipping firstly for 60 s, and Zn-dipping secondly for 30 s at room temperature.

关 键 词：Zr-Al合金 化学镀Ni-P镀层 浸锌处理 前处理 

分 类 号：TG174.4[金属学及工艺—金属表面处理]