苯甲醛改性双氰胺环氧固化剂的研究  

Researches of benzaldehyde-modified dicyandiamide as curing agent for epoxy resin

作　　者：程秀莲[1] 郭小伟[2] 杨艳玲[3] 

机构地区：[1]沈阳理工大学装备工程学院,辽宁沈阳110159 [2]沈阳东基集团有限公司,辽宁沈阳110045 [3]沈阳石蜡化工有限公司,辽宁沈阳110141

出　　处：《粘接》2015年第3期43-46,共4页Adhesion

摘　　要：用苯甲醛对双氰胺进行改性，制备了一种新型改性双氰胺固化剂。对合成条件进行了优化，并对其固化条件进行了研究。结果表明，苯甲醛改性双氰胺的较佳工艺条件为pH值3~4，苯甲醛与双氰胺物质的量比为1∶1.5，于95℃，反应2 h，收率65.67%。通过测试涂层硬度来考察固化工艺与性能。作为环氧树脂固化剂单独使用时，与环氧树脂的质量比为1∶10，固化温度为130℃固化8 h 涂膜硬度HV1=47.52。比双氰胺体系固化温度（160℃）降低了30℃。A novel curing agent, the benzaldehyde-modified was prepared. The optimal synthesis conditions and curing conditions were studied. The results showed that the better processing conditions were as follows：pH value was 3-4,the mole ratio of dicyandiamide to benzaldehyde was 1.5：1, the reaction temperature and time were 95℃and 2 h,respectively, and the yield of modified dicyandiamide was up to 65.67%. The curing process and properties were investigated by testing the paint membrane hardness. When the modified dicyandiamide was used as the epoxy resin curing agent, the ratio of modified dicyandiamide to epoxy resin was 1 to 10, the curing temperature and time were 130℃ and 8 h, the paint membrane hardness HV1 was 47.52 and this curing temperature was 30℃ lower than that for dicyandiamide alone（160℃）.

关 键 词：苯甲醛 双氰胺 环氧树脂 硬度 

分 类 号：TQ433.437[化学工程]