酸性硫酸盐镀铜电流下降而电压升高故障的分析  

Fault analysis about decreasing current with increasing voltage in acid sulfate copper plating

作　　者：霍大勇[1] 

机构地区：[1]喀什师范学院,新疆喀什844006

出　　处：《电镀与涂饰》2015年第3期145-148,共4页Electroplating & Finishing

摘　　要：通过10个故障实例,从设备、阳极、镀液成分、电镀温度等4个方面分析了酸性硫酸盐镀铜生产现场出现"电镀电流下降、电压升高"故障的原因,并给出了对应的处理方法,指出了预防类似故障的15个技术要点。The causes of decreasing current with increasing voltage in acid sulfate copper plating were analyzed from devices, anode, bath composition, and plating temperature in terms of 10 fault instances. The corresponding treatment measures were provided. Fifteen technical points to prevent faults were given.

关 键 词：酸性硫酸盐光亮镀铜 故障分析 直流母排 温度 阳极 

分 类 号：TQ153.14[化学工程—电化学工业]