连接参数对Ti53311S高温钛合金TLP连接接头性能的影响  

Effect of Bonding Parameters on the Properties of TLP Bonding Joints of Ti53311S Alloy

作　　者：张志伟[1] 王厚勤[2] 王文平[1] 

机构地区：[1]北京控制工程研究所,北京100190 [2]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001

出　　处：《宇航材料工艺》2015年第1期62-65,共4页Aerospace Materials & Technology

摘　　要：采用Cu作为中间层实现了Ti53311S合金的TLP连接,通过SEM、EDS方法分析了接头界面的微观组织,研究了接头界面微观组织及力学性能随TLP连接温度及保温时间的变化规律。结果表明:TLP连接接头的典型界面结构为Ti53311S/β-Ti/Ti、Cu(Sn)金属间化合物/β-Ti/Ti53311S。随着TLP连接温度的升高或保温时间的增加,焊缝宽度逐渐增加,Cu元素向母材侧的扩散程度更加充分,化合物相分解消失,接头室温抗拉强度先大幅升高后趋于稳定,连接工艺为980℃/20 min时,接头抗拉强度达到最大值899 MPa。Ti53311S alloy was successfully joined by TLP bonding with Cu filler metal. The interracial micro- structure was characterized by SEM and EDS. Effects of TLP bonding temperature and holding time on the joint micro- structure and mechanical properties were investigated in details. The results showed that the typical interracial micro- structure was Ti53311 S/β-Ti/Ti, Cu （Sn） intermetallic compound/β-Ti/Ti53311 S. The mutual diffusion degree be- tween base metal and Cu interlayer increased with the rise of TLP bonding temperature and increase of holding time, which caused the increase of the joint width and reduction of compound in the joint. The degree of diffusion affected the strength of the bonding greatly. The tensile strength of joints increased at first gradually and then tended to be sta- ble at room temperature. The highest tensile strength, which was achieved at the bonding temperature of 980℃hold- ing for 20 min, was 899 MPa.

关 键 词：Ti53311S TLP连接 微观组织 力学性能 

分 类 号：TG453.9[金属学及工艺—焊接]