AuNi9导电环刷丝的钎料成分改进及性能分析  

Solder Composition Improvement and Performance Analysis for the AuNi9 Conductive Ring Brush Wire

作　　者：李敏雪[1] 曲文卿[1] 代国琴 杨淑娟[2] 李睿[2] 

机构地区：[1]北京航空航天大学机械工程及自动化学院,北京100191 [2]北京控制工程研究所,北京100080

出　　处：《宇航材料工艺》2015年第1期73-76,共4页Aerospace Materials & Technology

摘　　要：采用Sn Pb、In Pb和In Pb Ag三种钎料对航天器控制系统中的Au Ni9刷丝进行了钎焊试验,对钎焊接头的力学性能、断口形貌以及微观组织、化合物相成分进行对比分析,探讨改进后钎料对钎焊接头化合物层形成的影响。结果表明,Sn Pb钎料钎焊Au Ni9刷丝接头区域靠近金合金一侧产生了明显的化合物,主要包括:Au Sn4及Au Ni2Sn4和Ni3Sn4化合物相。In Pb钎料能明显降低钎焊接头脆性,接头区域未发现金属间化合物的产生。InPb Ag钎料不仅能保护铜导线的镀银层,而且钎焊接头还会产生细小的强化相Ag2In,增强接头剪切强度。In this experiment selected SnPb, InPb and InPbAg three solders were selected to solder the AuNi9 brush wires which serve in the spacecraft control system. The mechanical properties, the fracture morphology, micro- structures and the composition of compound phases of soldered joints were compared, thus exploring the impact of the improved solder on the formation of the compound layer in soldered joints. The results show that there generate the ob- vious compounds in AuNi9 soldered joints near the gold alloy side using SnPb solder, mainly including AuSn4, Au- NiaSn4 and Ni3Sn4 compound phases. InPb solder can significantly reduce the joints brittleness, and there generate no intermetallie compounds in the joint region. While the InPbAg solder can not only protect the silver layer of copper wires, but also could produce the tiny strengthening phase, i. e. , Again in the joint to enhance the joint shearstrength.

关 键 词：AuNi9合金 锡铅钎料 铟铅钎料 金脆性 

分 类 号：TG425.1[金属学及工艺—焊接]