改性咪唑/环氧固化体系研究  

STUDY ON MODIFIED IMIDAZOLE/EPOXY CURING SYSTEM

作　　者：刘图远 王钧[1] 沈辉 胡艳志 

机构地区：[1]武汉理工大学材料科学与工程学院,湖北武汉430070 [2]上海复合材料科技有限公司,上海201100

出　　处：《玻璃钢／复合材料》2015年第3期26-30,共5页Fiber Reinforced Plastics/Composites

摘　　要：本文利用DSC研究了改性咪唑/环氧树脂的固化反应动力学方程,借助DSC和DMA研究了不同改性咪唑含量对固化反应和树脂玻璃化转变温度的影响,同时利用红外分析对其反应机理进行了探究。结果表明,改性咪唑/环氧树脂固化体系的表观活化能Ea为60.21k J/mol,频率因子A为2.459×107s-1;改性咪唑/环氧固化物的Tg随改性咪唑用量先增加后降低,当用量为4%时达到最大值163.3℃;改性咪唑在固化过程中存在解封反应及异氰酸酯和羟基的氨酯化反应。In this paper,the curing reaction kinetics equation of modified imidazole / epoxy was studied through the DSC to get a view of the influnence of the differernt content of modified imidazole on the Tg of the resin with DSC and DMA. At the same time,the reaction mechanism was studied by infrared analysis. The results showed that the Ea of modified imidazole / epoxy resin system is 60. 21 k J / mol and frequency factor A is 2. 459 ×10^7s^-1; the Tg of the modified imidazole / epoxy increased with the increase of modified imidazole first,then reduce with it. The maximum is 163. 3℃ when the content is 4%. Modified imidazole deblock and isocyanate react with the hydroxyl groups during the curing process.

关 键 词：改性咪唑 环氧树脂 动力学 玻璃化温度 解封 

分 类 号：TB332[一般工业技术—材料科学与工程]