电子工业用锡及锡基合金电镀技术:现状及展望  

Tin and tin alloy electroplating in electronic industry: present status and prospect

作　　者：贺岩峰[1] 鲁统娟[1] 王芳[1] 

机构地区：[1]长春工业大学化工学院,吉林长春130012

出　　处：《电镀与涂饰》2015年第4期217-222,共6页Electroplating & Finishing

摘　　要：概述了电子工业用锡及锡基合金(如锡–银、锡–铜和锡–铋)电子电镀技术的发展现状,重点探讨了了相关电镀工艺、镀层锡晶须生长问题和锡及锡合金电镀在先进封装中的应用现状,最后展望了电子工业用锡及锡合金电镀未来的发展趋势。The recent advances of tin and tin alloys （such as tin-silver, tin--copper, and tin-bismuth） electroplating in the electronic industry were reviewed. Related electroplating processes, tin whisker growth in coatings, and application status of tin and tin alloy electroplating in advanced electronic packaging were discussed. The future development tendency of tin and tin alloy electroplating in the electronics industry was predicted.

关 键 词：锡 锡合金 电镀 晶须 封装 电子工业 

分 类 号：TQ153.2[化学工程—电化学工业]