基于SEM纳米切削装置的设计与实验  

Design and Experiment on SEM Based Nanometric Cutting Device

作　　者：刘冰[1,2] 徐宗伟[2] 兀伟[2] 王志强[2] 

机构地区：[1]天津大学机械工程学院,天津300072 [2]天津大学精密测试技术与仪器国家重点实验室,天津300072

出　　处：《天津大学学报（自然科学与工程技术版）》2015年第1期56-61,共6页Journal of Tianjin University：Science and Technology

基　　金：国家重点基础研究发展计划(973计划)资助项目(2011CB706703;2011CB706700);国家自然科学基金资助项目(51275559)

摘　　要：针对目前纳米切削机理研究方法中切削过程无法在线高分辨力观测等瓶颈问题,设计并搭建了一套集成于扫描电子显微镜高真空条件下的纳米切削实验装置,开展了该实验装置的运动精度分析、典型单晶材料纳米切削在线观测等研究.该装置在切削及切深方向均能实现7,μm的位移输出,闭环分辨力为0.6,nm.通过白光干涉仪对纳米切削台阶加工结果的测量,分析装置运动精度,实现了切深分别为59.3,nm、115.1,nm和161.2,nm的台阶结构加工.利用直线刃金刚石刀具对单晶铜和单晶硅材料进行了纳米切削实验,实验结果表明所研制的纳米切削装置能够实现纳米尺度材料去除的在线高分辨力观测.To solve the problem that online high-resolution observation failed to be realized in cutting process with the current nanometric cutting mechanism,a nanometric cutting device under high vacuum condition based on SEM was designed and established. Motion accuracy analysis of the device was carried out and nanometric cutting of typical single crystal materials with online observation was researched. The proposed device can realize displacement output in the range of 7 μm with closed-loop resolution of 0.6,nm in both cutting direction and depth direction. The motion accuracy of the device was measured by white light interferometer. Step structures with different cutting depths were machined and the height differences between the steps were 59.3 nm,115.1 nm and 161.2 nm,respectively.Nanometric cutting experiment was carried out on single-crystal copper and silicon by using diamond tool with straight edge. The experimental result indicates that the developed nanometric cutting device enables nanoscale material removal behavior to be achieved with online high-resolution observation.

关 键 词：扫描电子显微镜 纳米切削 在线观测 运动精度 

分 类 号：TH122[机械工程—机械设计及理论] TH69