木/竹基复合材料在机电产品包装的应用  

Application of Wood/Bamboo-Based Composites for Electromechanical Product Packaging

作　　者：梁艳君[1,2,3] 于文吉[1,2] 

机构地区：[1]中国林科院木材工业研究所 [2]国家林业局木材科学与技术重点实验室,北京100091 [3]西南林业大学材料工程学院,云南昆明650224

出　　处：《木材工业》2015年第2期30-33,共4页China Wood Industry

基　　金：林业公益性行业科研专项"速生林木材高效重组制造关键技术"(2014040503)

摘　　要：我国机电产品的包装大量使用实木材料,面临着资源紧张和成本高昂等问题。通过分析机电产品包装材料的结构形式和承载要求,讨论重组木/竹复合材料在包装行业应用的可行性,从政策、成本和性能等方面,总结新型重组木/竹复合材料替代实木材料用于机电产品包装的优势及发展前景。Solid wood is used as the main material for electromechanical product packaging, resulting in not only concerns for wood supply shortage and high cost issues, but also has a great potential for new packaging materials like wood/bamboo-based composites. The authors analyze structure types and loading requirements for electromechanical product packaging, and then discuss the advantages of wood/bamboo-based composites for electro-mechanical products packaging. And finally, they introduce the development trend of the new wood/bamboo scrimber material for electromechanical products packaging.

关 键 词：木/竹基复合材料 重组木 重组竹 包装 机电产品 

分 类 号：TB484[一般工业技术—包装工程]