Ni-Al扩散界面及反应层生长动力学研究  

STRUCTURE AND GROWTH KINETICS OF INTERMETALLIC PHASE IN Ni-Al DIFFUSION COUPLE

作　　者：肖强[1] 李传军[1] 袁兆静[1] 余建波[1] 钟云波[1] 任忠鸣[1] 

机构地区：[1]上海大学上海市现代冶金和材料制备重点实验室,上海200072

出　　处：《上海金属》2015年第2期11-14,27,共5页Shanghai Metals

基　　金：国家重点基础研究发展计划(No.2011CB610404);上海市重大科技攻关项目(No.13521101102)和(No.13DZ1108200);中国博士后科学基金(No.2012T50411)资助

摘　　要：采用电镀法制备Ni-Al扩散偶,研究了Ni-Al扩散界面处中间相的形成及其生长动力学。结果表明,扩散偶界面处形成的中间相为NiAl3相和Ni2Al3相。Ni2Al3相的生长符合抛物线长大规律,受体扩散控制,NiAl3相的生长受晶界扩散和体扩散的控制。Ni2Al3的生长激活能Q=(155.6±4.05)kJ/mol,生长常数k0为5.23×10-4m2·s-1。The Ni-Al diffusion couple was prepared by electroplating,and the formation and growth kinetics of the intermediate phases in the Ni-Al were investigated. The results showed that Ni2Al3 and NiAl3 phase formed at the interface. The layer growth of the Ni2Al3 phase obeyed the parabolic law,which controlled by the volume diffusion mechanism. The layer growth of NiAl3 phase was controlled by both the volume diffusion and the grain boundary diffusion. The growth activation energy Q for Ni2Al3was（155. 6 ± 4. 05） k J / mol,and the growth constant k0 was 5. 23 × 10^- 4m2·s^- 1.

关 键 词：NI-AL 扩散偶 电镀 生长动力学 

分 类 号：TG113.14[金属学及工艺—物理冶金]