铝铜异种材料活性软钎焊的界面行为研究  

Study on Interface Behavior of Al-Cu Dissimilar Materials Activity Soldering

作　　者：杨拓宇[1,2] 张华[1] 陈丰[1] 夏显明[1] 

机构地区：[1]安徽科技学院机械工程学院,安徽凤阳233100 [2]南京理工大学材料科学与工程学院,江苏南京210094

出　　处：《热加工工艺》2015年第3期28-30,27,共4页Hot Working Technology

基　　金：安徽省教育厅自筹项目(KJ2013Z046);安徽科技学院校级一般项目(ZRC2013377)

摘　　要：采用Sn Zn Si低熔点合金作钎料,以丁烷火焰作热源,用含氟化氢铵的钎剂辅助润湿,对铝铜异种材料进行软钎焊,得到了润湿良好的钎焊接头。用扫描电镜结合电子探针对接头界面的组织形态和成分分布情况进行研究,得到了钎料及母材元素的扩散迁移情况。钎料中Zn、Si两种元素向母材防锈铝和铜基板迁移量较多,防锈铝中的Mg元素则大量越过钎料层向铜基板一侧快速扩散。在铜侧界面处会有少量扇贝状的Sn-Cu金属间化合物生成。Solder connections of dissimilar materials for aluminum and copper was carried out using low melting point alloy as solder SnZnSi, butane flame as heat source, ammonium fluoride-containing flux as assisted wetting. Good wetting soldered joints was gotten. The microstructure and composition distribution on the interface was researched by SEM and electron probe. Based on the results, the migration of solder and base metal elements was acquired. Migration value of Zn, Si elements in Solder to the rest-proof aluminum and copper was e, a great amount of Mg element in the rust-proof aluminum diffuses across the solder layer to the copper substrate. In addition, a little amount of intermetallic compound with scallop shape, consisting of Sn-Cu, is generated on the copper side of the interface.

关 键 词：软钎焊 界面行为 扩散 异种材料连接 

分 类 号：TG454[金属学及工艺—焊接]