非贵金属活化氧化铝陶瓷基板化学镀铜研究  

Study on Non-noble Metal Activation for Electroless Plating on Alumina Ceramic Substrate

作　　者：袁李俊 廖鸿 卢泽龙 罗来马[1] 陈九磅[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009 [2]中国贵州航空工业(集团)有限责任公司,贵州贵阳550009

出　　处：《热加工工艺》2015年第4期148-151,共4页Hot Working Technology

基　　金：国家自然基金青年项目(51204064)

摘　　要：提出一种新型的非贵金属活化法辅助二次化学镀的氧化铝陶瓷基板化学镀铜工艺,成功制备了表面完整、分布均匀的铜镀层,进一步通过冷场发射扫描电镜（FE-SEM）做了具体分析。可以发现,经预处理活化之后的氧化铝基板表面产生一定程度的表面缺陷,主要包括不同梯度的台阶,颗粒与颗粒之间的边缘化以及‘地道式’的孔洞。在第一次化学镀铜沉积一定量的铜颗粒之后表面仍存在大量的空隙,即未镀区域。但在二次化学镀工艺之后,表面完全覆盖镀层,其中镀层表面上小的圆球状（2~3μm）铜颗粒夹杂在大的胞状（4~5μm）颗粒之间,整体上为颗粒与颗粒的物理聚集然后通过堆垛而形成的。A new type of non-noble metal activation method with the second chemical copper plating process on alumina ceramic substrate was put out and integrated, uniform distribution of the copper coating was prepared successfully. With the field emission scanning electron microscope（FE-SEM） anglicizing the whole process, it can be found that there are lots of surface defects appearing on the alumina substrate after activation, including different gradient steps, the edge between the particles and the holes like a tunnel. Then, after the first chemical copper plating, it deposit a certain amount of copper particles on the surface, while there are still a lot of spaces namely the uncoated region. Then after the second chemical plating process, the plating surface is completely covered, which layer on the surface are small spherical（2-3 μ m） copper particles mixed in big cellular（4-5 μ m）. The whole particles are physically agglomerated and the films are formed by stacking.

关 键 词：氧化铝陶瓷 非贵金属活化 表面缺陷 二次化学镀 

分 类 号：TQ153[化学工程—电化学工业]