化学镀镍稳定剂的研究  

Research on the Stabilizer of Electroless Nickel Plating

作　　者：胡海娇[1] 武晓阳[1] 刘定富[1] 

机构地区：[1]贵州大学,贵州贵阳550025

出　　处：《电镀与环保》2015年第2期20-23,共4页Electroplating & Pollution Control

摘　　要：以镀速、镀层中磷的质量分数、镀液稳定性为评价指标,考察了Pb2+、Cu2+分别作稳定剂时和Cu2+与硫酸铈复配使用时的效果。结果表明:Pb2+的添加量变化范围比Cu2+的窄,同时Cu2+作稳定剂时镀液中Ni 2+的利用率较高。将50mg/L Cu2+和5mg/L硫酸铈复配使用,获得的镀速为10.69μm/h,镀层中磷的质量分数为10.18%,稳定常数为0.97,且镀层为非晶态结构。The influences of stabilizers on the plating rate,phosphorus mass fraction in coating and stability of plating bath were investigated when Pb^2＋and Cu^2＋used independently and Cu^2＋used in combination with cerous sulfate.Results showed that the addition amount range of Pb^2＋was narrower than that of Cu^2＋,and higher utilization ratio of Ni^2＋was realized at the premise taking Cu^2＋as stabilizer.Furthermore,a amorphous-structure coating was parepared with plating rate of 10.69μm/h when using 50 mg/L of Cu^2＋and 5 mg/L of cerous sulfate as the stabilizer.Determination showed that phosphorus mass fraction in the coating was 10.18%,and the stability constant was 0.97.

关 键 词：化学镀镍 稳定剂 镀速 磷的质量分数 稳定常数 

分 类 号：TQ153[化学工程—电化学工业]