多层电路板的深层充电研究  

Study on internally dielectric charging of multilayer circuit board

作　　者：王建昭 陈鸿飞[1] 于向前[1] 邹鸿[1] 施伟红[1] 

机构地区：[1]北京大学空间物理与应用技术研究所,北京100871

出　　处：《中国科学：技术科学》2015年第3期330-337,共8页Scientia Sinica(Technologica)

基　　金：国家自然科学基金(批准号:41374181);国家重大科学仪器专项(批准号:2012YQ03014207)资助项目

摘　　要：以欧空局的FLUMIC2模型为输入电子能谱,基于Monte Carlo方法和辐射诱导电导率模型进行多层电路板充电分析,可模拟地球同步轨道上有2 mm铝层屏蔽时的多层FR4印刷电路板的深层充电过程,得到电场和电势随介质深度的变化.研究发现与双面接地电路板相比较,电路板四层铺铜接地内部最大充电电场减少54%,有效地减小介质内部电场,降低深层放电风险.充电时间常数和电介质的物理特性有关而与电路板分层情况无关.分析各接地层的电流,两层电路板为90-150 pAm^-2,四层电路板为10-100 pAm^-2.Based on the ESA＇s FLUMIC2, which is an electron spectrum model for high earth orbits, we use the Monte Carlo method and the radiation-induced conductivity （RIC） model to simulate the internal charging process of the multilayer FR4 printed circuit board （PCB） which is shielded by 2 mm aluminum and on the geosynchronous orbit （GEO）. The simulation calculates the electric field deep in the PCB. The field is decreased by 54% of the four-layer PCB with the conducted layers grounded comparison to the two-layer grounded PCB. It shows that the multilayer PCB can mitigate the risk of the charging-discharging effect. The constant of the charging time does not depend on layers of PCB but depends on the properties of the dielectric. The electric currents of the grounding layers are about 90-150 pA m^-2 for two-layer PCB, while are 10-100 pA m^-2 for four-layer PCB. It depends on the electron flux and the properties and thickness of the dielectric layer.

关 键 词：深层充电 辐射诱导电导率 GEANT4 MONTE Carlo 方法 地球同步轨道 

分 类 号：TN41[电子电信—微电子学与固体电子学] V520[航空宇航科学与技术—人机与环境工程]