基于TMS470单片机的高温RS485串行通信功能设计  

Design of high temperature RS485 serial communication based on TMS470

作　　者：石倩[1] 潘兴明[1] 王晨[1] 路胜杰 尹文颖[1] 

机构地区：[1]北京石油机械厂,北京100083

出　　处：《电子设计工程》2015年第6期187-189,192,共4页Electronic Design Engineering

摘　　要：石油钻井环境要求单片机系统可以在高温或超高温条件下具备与外界通信的功能。基于TI公司TMS470单片机SCI模块,结合SN65HVD11通信芯片设计耐高温的RS485串行通信硬件接口,并根据SCI模块特性编写了串行通信的收发数据软件程序。试验证明,通信功能可在200℃高温环境下稳定运行,数据传输准确可靠。High temperature serial communication of MCU system is widely applied in oil drilling environment. An RS485 serial communication hardware interface is designed based on the communication chip SN65HVD11, whose receiving and transmitting software is developed on the basis of the SCI module of the TMS470 manufactured by TI Company. The communication system can run steadily and reliably in 200 ℃ high temperature environment.

关 键 词：TMS470 SCI 串行通信 RS485 200℃ 

分 类 号：TN409[电子电信—微电子学与固体电子学]