硅铝合金在微波模块电路封装中的应用  

Application of Si-Al Alloy on Circuit Assembly of Microwave Modules

作　　者：陈以钢[1] 田飞飞[1] 邵登云[1] 戴立强[1] 祝超[1] 

机构地区：[1]南京电子器件研究所,南京210016

出　　处：《半导体技术》2015年第4期308-313,共6页Semiconductor Technology

摘　　要：硅铝合金以其重量轻、高热导率以及可调节热膨胀系数(CTE)的优越综合性能,在电子产品特别是微波组件中得到越来越广泛的应用。利用ANSYS软件系统地对Si50Al合金和硬铝合金进行热和结构静力分析,结果表明Si50Al合金具有更好的力学性能。通过对Si50Al合金进行热膨胀系数测试和焊接应力分析显示,Si50Al合金与Al2O3基陶瓷基板有较好的热匹配。机械加工、表面镀覆、元器件装联和密封实验表明,Si50Al合金完全可以替代硬铝合金、铜等作为微波组件的封装壳体和芯片载体材料,其与陶瓷基板和Ga As等半导体芯片衬底材料热膨胀匹配性好,并可成功地应用于高可靠微波模块电路的封装。Si-Al alloys have excellent performances,such as light-weight,high thermal conductivity and adjustable coefficient of thermal expansion（ CTE） due to controllable contents of silicon and aluminum,thus can be widely used for electronic components,especially microwave modules. The thermal and structural static analyses of Si50 Al alloy and duralumin were carried out based on the ANSYS finite element software. The results show that Si50 Al alloy has better mechanical property. According to the analyses of CTE and welding stress of Si-Al alloy,Si50 Al alloy has better thermal match performance with ceramic substrates. From mechanical machining,surface plating,component assembly and seal test,Si50 Al alloy can replace duralumin and copper acting as packaging shell and chip carrier materials in microwave module due to its better thermal match with ceramic substrates,Ga As and other backing materials of semiconductor chips. It can be successfully used in packaging of high-reliability microwave integrated circuits.

关 键 词：微波模块 硅铝合金 热匹配 力学仿真 气密封焊 

分 类 号：TN304[电子电信—物理电子学] TG146.2[一般工业技术—材料科学与工程]