粗晶硅铁合金的残余应力测定  

Measurement of Residual Stress of Coarse-grained Ferrosilicon Alloy

作　　者：王继群[1] 

机构地区：[1]北京工业职业技术学院机电工程学院,北京100042

出　　处：《铸造技术》2015年第3期823-825,共3页Foundry Technology

摘　　要：根据X射线对单晶材料残余应力的测量方法,对再结晶处理后粗晶硅铁合金的残余应力进行了测定。结果表明,残余应力的测试需要6个衍射晶面,并且衍射晶面越多,残余应力的测定结果越准确。According to the measure method of the residual stress of single crystal using X-ray, the residual stress of the coarse-granular ferrosilicon alloy after recrystallization was measured. The results show that the test of the residual stress needs six diffraction planes. And the more the diffraction plane, more accurate the residual stress value.

关 键 词：粗晶硅铁合金 再结晶 残余应力 

分 类 号：TG115[金属学及工艺—物理冶金]