硅片多线切割机主辊变形的研究分析  

Research on the Guide Roller's Deformation of Wafer Multi-wire Cutting

作　　者：殷华林 岳伟 

机构地区：[1]常州贝斯塔德机械股份有限公司,江苏常州213023

出　　处：《机械研究与应用》2015年第2期32-33,共2页Mechanical Research & Application

摘　　要：对硅片多线切割机关键部件主辊的变形进行了研究,通过主辊的建模,对其受力分析,通过静力学有限元分析求解出结果。通过对市场上目前主流机型的主辊变形分析对比和变形对切割硅片质量影响的对比,得出主辊设计的一些关键参数。重点是对硅片多线切割机的研究发展有一定的指导意义。Research on the guide roller′s deformation of the critical components in the wafer multi-wire sawing machine is conducted in this paper.Through the guide roller′s model and its force analysis, the results could be obtained with the static finite element analysis.By comparing the deformations of current mainstream cutting machine on the market and the influence that the deformation on cutting wafer quality, some key parameters of the main rollers are got.This article focuses on the de-formation parameters of the guide roller, and it will help to guide the research and development of wafer multi-wire sawing ma-chine.

关 键 词：多线切割 ANSYSWORKBENCH 主辊变形 

分 类 号：TN305[电子电信—物理电子学]