Investigation on the interface of Cu/Al couples during isothermal heating  

作　　者：Yan-qiu Han Li-hua Ben Jin-jin Yao Shu-wei Feng Chun-jing Wu 

机构地区：[1]School of Materials Science and Engineering, University of Science and Technology Beijing

出　　处：《International Journal of Minerals,Metallurgy and Materials》2015年第3期309-318,共10页矿物冶金与材料学报（英文版）

基　　金：financially supported by the National Natural Science Foundation of China (No. 51274038)

摘　　要：The evolutionary process and intermetallic compounds of Cu/A1 couples during isothermal heating at a constant bonding tem- perature of 550℃ were investigated in this paper. The interracial morphologies and microstructures were examined by optical microscopy, scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. The results suggest that bonding is not achieved between Cu and A1 at 550℃ in 10 min due to undamaged oxide films. Upon increasing the bonding time from 15 to 25 min, however, metallurgical bonding is obtained in these samples, and the thickness of the reactive zone varies with holding time. In the interfacial region, the final microstructure consists of Cu9A14, CuAl, CuA12, and ct-A1 ＋ CuAl2. Furthermore, these results provide new insights into the mechanism of the imerfacial reaction between Cu and A1. Microhardness measurements show that the chemical composition exerts a signifi- cant influence on the mechanical properties of Cu/A1 couples.The evolutionary process and intermetallic compounds of Cu/A1 couples during isothermal heating at a constant bonding tem- perature of 550℃ were investigated in this paper. The interracial morphologies and microstructures were examined by optical microscopy, scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. The results suggest that bonding is not achieved between Cu and A1 at 550℃ in 10 min due to undamaged oxide films. Upon increasing the bonding time from 15 to 25 min, however, metallurgical bonding is obtained in these samples, and the thickness of the reactive zone varies with holding time. In the interfacial region, the final microstructure consists of Cu9A14, CuAl, CuA12, and ct-A1 ＋ CuAl2. Furthermore, these results provide new insights into the mechanism of the imerfacial reaction between Cu and A1. Microhardness measurements show that the chemical composition exerts a signifi- cant influence on the mechanical properties of Cu/A1 couples.

关 键 词：COPPER ALUMINUM intermetallic compounds oxide films isothermal heating 

分 类 号：TB331[一般工业技术—材料科学与工程]