带有强化换热结构的芯片散热器实验研究与数值模拟  

Numerical Simulation and Experimental Study on Chip Radiator with Enhanced Heat Transfer Structure

作　　者：诸凯[1] 王华峰[1] 王建惠[1] 张密[1] 杨洋[1] 

机构地区：[1]天津商业大学天津市制冷技术重点实验室,天津300134

出　　处：《制冷学报》2015年第2期46-51,共6页Journal of Refrigeration

基　　金：天津市应用基础与前沿技术研究重点计划项目(13JCZDJC27300)资助~~

摘　　要：超级或大型计算机服务器CPU的冷却散热问题,已经成为计算机高性能发展的瓶颈,受到业内越来越广泛的关注。本文提出了一种用于冷却计算机服务器芯片的散热器,其结构是将镶嵌在散热器底板的热管与翅片组装为一体。利用自建实验台对该散热器以及平板式热管散热器的性能进行了对比实验分析,同时对其热管本体、翅片以及均温板的温度分布进行了数值模拟。这种热管冷凝段得到强化换热的散热器其底板面积相对平板式热管散热器减小了50%,因此具有更好的均温性;在相同的工况下热流密度由24.3 W/cm2增至68.6 W/cm2时,该散热器翅片顶部的平均温度增幅仅为17%。The heat dissipation of super or large computer server CPU has become the bottleneck for the development of high performance computer,therefore the cooling of super or large computer server attracted more and more attention. This paper proposes a type of radiator for cooling of computer server chip,in which heat pipe which is embedded in the radiator base plate is assembled with fin as a whole. A test bench was built,and the performance of the plate type heat pipe radiator and the proposed radiator was compared experimentally. The temperature distribution of the heat pipe body,the fin and the uniform temperature board was simulated numerically. The heat transfer in the condensing section in the proposed radiator is enhanced,so the floor area of the proposed radiator is reduced 50% compared with the plate type heat pipe radiator,and the proposed radiator has a better temperature uniformity. Under the same conditions,the average temperature of the top radiator fin is only increased 17% when the heat flux is increased from 24. 3 W / cm^2 to 68. 6 W / cm^2.

关 键 词：芯片冷却 强化换热 芯片散热器 数值模拟 

分 类 号：TB657.5[一般工业技术—制冷工程] TK172[动力工程及工程热物理—热能工程]